This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.
Published Date: 01/31/2017
DoD Adopted: No
ANSI Approved: No
Single-Device DRM-Protected Document
This document has single-device/user digital rights management (DRM) protection. This document will only be accessible by a single user on a single device. If you are purchasing this DRM-protected document for another user, you will need to provide contact information for that user when placing your order.
For information about IPC standards with DRM protection, visit www.ipc.org/drm.